i ntegrated c ircuits d ivision www.ixysic.com ds-laa125-r06 1 laa125 dual single-pole, normally open optomos ? relays e 3 pb part # description laa125 8 pin dip (50/tube) laa125s 8 pin surface mount (50/tube) LAA125STR 8 pin surface mount (1,000/reel) laa125p 8 pin flat pack (50/tube) laa125ptr 8 pin flat pack (1,000/reel) parameter ratings units blocking voltage 350 v p load current 170 ma rms / ma dc on-resistance (max) 16 ? applications features description approvals ordering information pin configuration switching characteristics of normally open (form a) devices ? 3750v rms input/output isolation ? low drive power requirements (ttl/cmos compatible) ? no moving parts ? high reliability ? arc-free with no snubbing circuits ? fcc compatible ? vde compatible ? no emi/rfi generation ? small 8-pin packages ? machine insertable, wave solderable ? surface mount and tape & reel versions available ? telecommunications ? telecom switching ? tip/ring circuits ? modem switching (laptop, notebook, pocket size) ? hook switch ? dial pulsing ? ground start ? ringing injection ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment-patient/equipment isolation ? security ? aerospace ? industrial controls laa125 is a 350v, 170ma, 16 ? dual normally open (1-form-a) relay. it combines enhanced peak load current capability with low on-resistance. its mosfet switches and photovoltaic die provide 3750v rms of input to output isolation. the optically coupled outputs, that use patented optomos architecture, are controlled by a highly efficient gaaias infrared led. this dual switch optomos relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating two switches in a single 8-pin package. ? ul recognized component: file e76270 ? csa certified component: certificate 1175739 ? en/iec 60950-1 certified component: tuv certificate b 09 07 49410 004 1 2 3 4 8 7 6 5 + control - switch #1 - control - switch #1 + control - switch #2 - control - switch #2 load - switch #1 load - switch #1 load - switch #2 load - switch #2 form-a i f i load 10% 90% t on t off
i ntegrated c ircuits d ivision www.ixysic.com 2 r06 laa125 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. parameter conditions symbol min typ max units output characteristics load current continuous - i l - - 170 ma rms / ma dc peak t =10ms i lpk - - 400 ma p on-resistance i l =170ma r on --16 ? off-state leakage current v l =350v p i leak --1 ? a switching speeds turn-on i f =5ma, v l =10v t on --5 ms turn-off t off --5 output capacitance v l =50v, f=1mhz c out -50- pf input characteristics input control current for activation i l =170ma i f --5 ma input control current for deactivation - - 0.4 0.7 - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a input to output capacitance - c i/o -3- pf parameter ratings units blocking voltage 350 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 150 mw total power dissipation 2 800 mw isolation voltage, input to output 3750 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / c 2 derate linearly 6.67 mw / c absolute maximum ratings @ 25c electrical characteristics @ 25c
i ntegrated c ircuits d ivision laa125 www.ixysic.com 3 r06 performance data @25oc (unless otherwise noted)* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. typical led forward voltage drop (n=50, i f =5ma) 35 30 25 20 15 10 5 0 1.17 1.19 1.21 1.23 1.25 led forward voltage drop (v) device count (n) typical turn-on time (n=50, i f =10ma, i l =120ma dc ) 1.6 1.7 1.8 1.9 2.0 2.1 2.2 turn-on time (ms) device count (n) 25 20 15 10 5 0 typical turn-off time (n=50, i f =10ma, i l =120ma dc ) 0.3 0.5 0.7 0.2 0.4 0.6 0.8 turn-off time (ms) device count (n) 25 20 15 10 5 0 typical i f for switch operation (n=50, i l =170ma dc ) led current (ma) device count (n) 25 20 15 10 5 0 0.54 0.78 0.90 0.42 0.30 0.66 typical i f for switch dropout (n=50, i l =170ma dc ) 25 20 15 10 5 0 0.30 0.40 0.78 0.18 0.35 0.45 led current (ma) device count (n) typical on-resistance distribution (n=50, i l =170ma dc ) 35 30 25 20 15 10 5 0 12.64 12.92 13.2 12.5 12.78 13.06 on-resistance ( : ) device count (n) 12.36 typical blocking voltage distribution (n=50) 25 20 15 10 5 0 400 410 420 430 blocking voltage (v p ) device count (n) 390 440 typical led forward voltage drop vs. temperature temperature (oc) led forward voltage drop (v) 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 i f =50ma i f =10ma i f =5ma typical turn-on time vs. led forward current (i l =170ma dc ) led forward current (ma) turn-on time (ms) 0 5 1015202530354045 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 50 typical turn-off time vs. led forward current (i l =120ma dc ) led forward current (ma) turn-off time (ms) 0 1015202530354045 0.60 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0 50 55
i ntegrated c ircuits d ivision www.ixysic.com 4 r06 laa125 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. performance data @25oc (unless otherwise noted)* typical on-resistance vs. temperature (i l =170ma dc ) temperature (oc) on-resistance ( : ) -40 20 18 16 14 12 10 0 -20 0 20406080100 120 i f =5ma i f =10ma i f =5ma i f =10ma i f =5ma single pole dual pole instantaneous typical turn-on time vs. temperature (i l =80ma dc ) temperature (oc) i f =5ma i f =10ma turn-on time (ms) -40 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 typical turn-off time vs. temperature (i l =120ma dc ) temperature (oc) turn-off time (ms) -40 0.6 0.5 0.4 0.3 0.2 0.1 0 -20 0 20 40 60 80 100 i f =5ma typical i f for switch operation vs. temperature (i l =170ma) temperature (oc) led current (ma) -40 3.6 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 -20 0 20 40 60 80 100 typical i f for switch dropout vs. temperature (i l =170ma dc ) temperature (oc) led current (ma) -40 1.7 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -20 0 20 40 60 80 100 typical load current vs. load voltage (i f =5ma) load voltage (v) load current (ma) 200 150 100 50 0 -50 -100 -150 -200 -2.0 -1.5 -1.25 -0.625 0 0.625 1.25 1.875 3.0 typical blocking voltage vs. temperature temperature (oc) blocking voltage (v p ) -40 340 335 330 325 320 315 310 305 -20 0 20 40 60 80 100 typical leakage vs. temperature measured across pins 5&6 or 7&8 temperature (oc) leakage ( p a) -40 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 -20 0 20 40 60 80 100 energy rating curve time load current (a) 1.2 1.0 0.8 0.6 0.4 0.2 0 10 p s 1ms 100ms 10s 100 p s 10ms 1s 100s maximum load current vs. temperature temperature (oc) load current (ma) 200 175 150 125 100 75 0 -40 -20 0 20 40 60 80 120 100 i f =5ma i f =10ma i f =5ma i f =10ma single pole dual pole
i ntegrated c ircuits d ivision laa125 www.ixysic.com 5 r06 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating laa125 / laa125s / laa125p msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time laa125 / laa125s 250oc for 30 seconds laa125p 260oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision www.ixysic.com 6 r06 laa125 mechanical dimensions laa125 laa125s laa125p dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.508 (0.360 0.020) 0.457 0.076 (0.018 0.003) 9.652 0.381 (0.380 0.015) 7.239 typ. (0.285) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0.813 0.102 (0.032 0.004) 8-0.800 dia. (8-0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) pin 1 0.254 0.0127 (0.010 0.0005) dimensions mm (inches) pcb land pattern 9.398 0.127 (0.370 0.005) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.254 (0.300 0.010) 0 min / 0.102 max (0 min / 0.004 max) 2.286 max. (0.090 max.) 0.203 0.013 (0.008 0.0005) 0.635 0.127 (0.025 0.005) 9.652 0.381 (0.380 0.015) 0.457 0.076 (0.018 0.003) 2.159 0.025 (0.085 0.001) 2.54 (0.10) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 0.864 0.120 (0.034 0.004) pin 1 dimensions mm (inches) pcb land pattern 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 6.350 0.127 (0.250 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) 0.813 0.102 (0.032 0.004) 4.445 0.127 (0.175 0.005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 0.254 0.0127 (0.010 0.0005) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) pin 1
i ntegrated c ircuits d ivision for additional information please visit our website at: www.ixysic.com laa125 7 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-laa125-r06 ?copyright 2012, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/19/2012 mechanical dimensions LAA125STR tape & reel laa125ptr tape & reel dimensions mm (inches) user direction of feed notes: 1. dimensions carry tolerances of eia standard 481-2 2. tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 1 =4.20 (0.165) 0 k =4.90 (0.193) p=12.00 (0.472) w=16.00 (0.63) bo=10.30 (0.406) ao=10.30 (0.406) dimensions mm (inches) notes: 1. all dimensions carry tolerances of eia standard 481-2 2. the tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) user direction of feed p = 12.00 (0.472) w = 16.00 (0.63) bo = 10.30 (0.406) ao = 10.30 (0.406) k 1 = 2.00 (0.079) k 0 = 2.70 (0.106) 7.50 (0.295) 2.00 (0.079) 4.00 (0.157)
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